April 5, 2024
Conference Paper

A Micro-scale Numerical Investigation of Internal and Interfacial Void Defects in Adhesive on Failure Behavior of Adhesively-Bonded Materials with Rough Surfaces

Abstract

This paper studied the effects of air void defects on the failure behavior of adhesively-bonded materials under global shear via micro-scale computational modeling. The numerical results indicated that interfacial void defects can largely facilitate interfacial debonding of a weaker adherend/adhesive interface under shear. However, this is not the case for a stronger adherend/adhesive interface, showing the reduction on the nominal shear strength of an adhesive joint is mainly due to internal void defects. The reduced bonding performance due to voids can be improved by leveraging an appropriate surface roughness. This preliminary investigation is a first step to better understand the micro-mechanics of interfacial failure in the adhesion of a roughened/patterned adherend via surface modification(s) and an adhesive, and also shows the importance of minimizing interfacial void defects in particular at a weaker adherend/adhesive interface via different techniques.

Published: April 5, 2024

Citation

Qiao Y., S. Ko, A. Samanta, D.R. Merkel, Y. Shin, A.D. Guzman, and E.K. Nickerson, et al. 2023. A Micro-scale Numerical Investigation of Internal and Interfacial Void Defects in Adhesive on Failure Behavior of Adhesively-Bonded Materials with Rough Surfaces. In ASME Aerospace Structures, Structural Dynamics, and Materials Conference (SSDM 2023), June 19-21, 2023, San Diego, CA, Paper No: SSDM2023-105653, V001T03A001. New York, New York:ASME. PNNL-SA-181181. doi:10.1115/SSDM2023-105653

Research topics